| 型号/型号规格 | 分类 | 品牌 | 封装 | 批号 | 数量 | 询价 | ||
|---|---|---|---|---|---|---|---|---|
| LT1963ES8 | ADI/亚德诺 |
SOP8 |
23+ |
2845 |
||||
| AT25256B-SSPDGV-T | MICROCHIP/微芯 |
SOIC8 |
21+ |
523 |
||||
| ADXL351WBEZ-RL | ADI/亚德诺 |
19+ |
432 |
|||||
| STM32F777NIH6 | ST/意法 |
BGA216 |
23+ |
3 |
||||
| MAX24287ETK+ | MAXIM/美信 |
QFN68 |
15+ |
475 |
||||
| SC3E5-90LSMD | SOCAY/硕凯 |
8.2*5MM |
25+ |
1000 |
||||
| DS38EP100SD/NOPB | TI/德州仪器 |
WSON-6 |
22+ |
250 |
||||
| XC3S1600E-5FG484C | XILINX/赛灵思 |
BGA |
2011+ |
2 |
||||
| SC668019SFVKBR | NXP/恩智浦 |
VFBGA-176 |
20+ |
3987 |
||||
| EPM3128ATI100-10N | ALTERA/阿尔特拉 |
TQFP100 |
18+ |
149 |
||||
| MACH435-15JC-20JI | ADVANCED MICRO DEVICES |
PLCC84 |
02+ |
1440 |
||||
| IS46LQ32128A-062BLA2 | ISSI/芯成 |
BGA-200 |
21+ |
7121 |
||||
| DF57H-3P-1.2V(21) | HIROSE/广濑 |
SMD |
16+ |
18369 |
||||
| M27C256B-90C6 | ST/意法 |
PLCC |
0231+ |
498 |
||||
| PALCE29M16H-25DC | AMF |
DIP-24 |
9931+ |
15 |
||||
| IS24C01B-2GLI | ISSI/芯成 |
SOP |
07+ |
1733 |
||||
| MJE13007 | ER |
TO220 |
05+ |
681 |
||||
| S-80928CNNB-G8YT2G | SEIKO/精工 |
SOT343 |
13+ |
3000 |
||||
| S-80825CLMC-B6KT2G | SEKIO |
SOT23-5 |
10+ |
2059 |
||||
| SN74CBT1G384DCKR | TI/德州仪器 |
SOT-353 |
1149+ |
1000 |
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